Compartir
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling (en Inglés)
Yong Liu
(Autor)
·
Springer
· Tapa Blanda
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling (en Inglés) - Liu, Yong
$ 489.44
$ 679.78
Ahorras: $ 190.34
Elige la lista en la que quieres agregar tu producto o crea una nueva lista
✓ Producto agregado correctamente a la lista de deseos.
Ir a Mis Listas
Origen: Estados Unidos
(Costos de importación incluídos en el precio)
Se enviará desde nuestra bodega entre el
Lunes 15 de Julio y el
Lunes 22 de Julio.
Lo recibirás en cualquier lugar de Internacional entre 1 y 3 días hábiles luego del envío.
Reseña del libro "Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling (en Inglés)"
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions
